INTEL DP55WG MANUAL PDF

The date the product was first introduced. Max Memory Size dependent on memory type Max memory size refers to the maximum memory capacity supported by the processor. Max of Memory Channels The number of memory channels refers to the bandwidth operation for real world application. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

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Table 18 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table Page 49 Technical Reference 2. When the switch is closed, the board resets and runs the POST. Table 19 shows the possible states for a one-color LED.

Table 20 shows the possible states for a two-color LED. Figure Page 51 Technical Reference 2. Always turn off the power and unplug the power cord from the computer before changing a jumper setting.

Otherwise, the board could be damaged. Figure 15 shows the location of the jumper block. Table 21 describes the jumper settings for the three modes: normal, configure, and recovery.

The maintenance menu is displayed. Page 53 Technical Reference 2. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.

Page 55 Technical Reference 2. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 23 lists the current capability of the fan headers. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. Localized High Temperature Zones Table 24 provides maximum case temperatures for the components that are sensitive to thermal changes.

The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is ,

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